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RK2206

典型应用方向

主要特性

  • Cortex-M4F Up To 200MHz
  • Tensilica HiFi3 DSP Up To 300MHz
  • Built-in 448K Byte SRAM & DTCM
  • Embedded 8M/4M Byte FLASH & PSRAM
  • WLAN 802.11 b/g/n
SPECIFICATIONS
CPU • Cortex-M4F Up To 200MHz
DSP • Tensilica HiFi3 DSP Up To 300MHz
Memory • Built-in 256KB SRAM，192KB DTCM
• Built-in 8/4 MB Flash
• Built-in 8/4 MB PSRAM
• Support EMMC,SD/MMC Card
Audio ADC • 3CH Audio-ADC,1CH Audio-DAC (With-in RK812)
• Class D Audio PA(With-in RK812)
Connectivity • Built-in Power Management(With-in RK812)
• DVP Sensor Interface
• USB2.0 OTG, SPI, UART，I2C，PDM, I2S
Display • MCU/SPI LCD Interface
Audio • Multi-format audio encoder & decoder
OS • Free RTOS
 
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